| 1. | Power densities that can be tolerated by a gage are strongly related to the specimen which serves as the heat sink .
应变片所能允许的电能密度与起着散热器作用的试件密切相关。 |
| 2. | Robust optimization design for microchannel heat sinks
微通道热沉的稳健优化设计 |
| 3. | Heat sink of semiconductor devices - generic specification
半导体器件散热器通用技术条件 |
| 4. | Free p4 powerful heat sink with cooling fan
附送强劲p4风扇连散热油一盒 |
| 5. | Heat sink of semiconductor devices - heat sink , extruded shapes
半导体器件散热器型材散热器 |
| 6. | Selecting guide of heat sink for power semiconductor device
电力半导体器件用散热器选用导则 |
| 7. | Increasing surface area can increase efficiency of aluminum heat sink
亦可增强铝片散热的效能 |
| 8. | How to select the suitable heat sink
如何选择合适的散热片？ |
| 9. | Heat sink of semiconductor devices - heat sink , staggered fingers shapes
半导体器件散热器叉指形散热器 |
| 10. | General specification of heat sink of colour television receiver
彩色电视接收机用散热器.通用技术条件 |
